AlSi27
Product Description
AlSi27 carrier plate replacing Al6061 and Copper in PCBs(metal-clad laminate) for high frequency application;
AlSi27 cover lids replacing Kovar in optoelectronic industry.
AlSi27 T/R modules replacing Kovar and Cu-Mo in RF/microwave,millimeter wave industry.
Applications
Telecom;
Optoelectronic Industry;
RF/microwave;
Millimeter Wave Field
Advantages
CTE matching to PCB laminate;
High stiffness;
Readily machinable,plateable,weldable;
Alloy Density
g/cm³ CTE
25℃ ppm/℃ Thermal Conductivity
25℃ W/m.K Elastic Modulus
GPa
AlSi27 2.6 17 175 91
Si% Poisson’s Ratio Elongation
% Tensile Strength
MPa Yield Strength
MPa
27% 0.29 3.8 170 130
Product Description
AlSi27 carrier plate replacing Al6061 and Copper in PCBs(metal-clad laminate) for high frequency application;
AlSi27 cover lids replacing Kovar in optoelectronic industry.
AlSi27 T/R modules replacing Kovar and Cu-Mo in RF/microwave,millimeter wave industry.
Applications
Telecom;
Optoelectronic Industry;
RF/microwave;
Millimeter Wave Field
Advantages
CTE matching to PCB laminate;
High stiffness;
Readily machinable,plateable,weldable;
Alloy Density
g/cm³ CTE
25℃ ppm/℃ Thermal Conductivity
25℃ W/m.K Elastic Modulus
GPa
AlSi27 2.6 17 175 91
Si% Poisson’s Ratio Elongation
% Tensile Strength
MPa Yield Strength
MPa
27% 0.29 3.8 170 130